2006 Surface Preparation and Cleaning Conference

04-05 May 2006
Austin, Texas

 

Proceedings from this workshop are available for ordering.

SEMATECH and ISMI members can access these conference proceedings at no charge on the SEMATECH Member Site.

Agenda

 
Keynote Oscilowski (SEMATECH)
International Technology Roadmap for Semiconductors - Front End Processes Overview Butterbaugh (ITRS)
Characterization and Damage-Free Cleaning of FinFET Structures  Lauerhaas (FSI)
A Novel Chemical Oxide Removal Process to Meet Current and Future Surface Preparation Challenges Brown (TEL)
Recent Advances in the Electrohydrodynamic (EHD) Cleaning Process Finster (EHD Technology Group)
Single Wafer Wet Cleaning Performance and Particle Removal > 36 nm Sano (DNS)
Single Wafer Immersion Processing for sub 65nm FEOL Critical Cleans Rosato (AMAT)
Development of SiGe Cleaning Solutio Using Dilute SC1 Mun (Samsung)
Photomask Resist Removal and Cleaning with Sulfur-free Chemistry and Damage-Free Cleaning Technology Gouk (AMAT)
Ash-Free, Wet Stripping of Heavily Implanted Photoresist Butterbaugh (FSI)
A Novel Photoreactive Surface Processing System Elliott (UVTech Systems) 
A Study of Resist Removal and Damage in Non-Ashing High Dose Implant Strip Banerjee (Eco-Snow Systems )

 

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